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Renlab Ultrasonic Cutting Knife A35_Portable Motherboard Box
IP Report
Print Profile(1)
0.2mm layer, 2 walls, 15% infill
Designer
1.5 h
1 plate
Open in Bambu Studio
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Description
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Renlab Ultrasonic Cutting Knife A35_Portable Motherboard Box Printing Guide:
Applicable Machines: P Series, X Series, A Series, H2D
nozzle Specifications: 0.4mm
Applicable Material: PLA (other materials to be tested)
Bill of Materials (excluding printed parts): Motherboard x1 (needs to be removed from original host box)
Printed Parts List: Motherboard Cover x1, Motherboard Box x1
Printing Settings: Motherboard Cover_Normal Support 30°, Motherboard Box_no supports
Disassembly Instructions:
1. Remove internal components from the box (handle & straight data cable & angled data cable & hex wrench & blade tubes x4 & adapter)
2. Turn the bottom of the box upwards and remove the footpads.2. Turn the bottom of the box upwards and remove the footpads
3. Remove 4 screws
4. Separate the top and bottom shells of the box, remove the 4 screws securing the motherboard, and take out the motherboard
Assembly Instructions:
1. Remove the printed parts and remove supports
2. Place the motherboard into the motherboard compartment
3. Snap together the motherboard cover assembly
4. Assembly completed
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