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HIKSEMI SSD Enclosure Replacement Back Cover
IP Report
Print Profile(1)
0.2mm layer, 2 walls, 15% infill
Designer
15 min
1 plate
Open in Bambu Studio
Boost
7
8
0
0
18
1
Released
Description
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The back cover of the HIKSEMI HIK M2 SSD enclosure, adapted for a heatsink, strengthens the heat dissipation of memory particles, improving product lifespan and performance.
Boost Me (for free)
如果我的设计有帮助到您，希望能为我投一个免费的助力！谢谢！ If my design has been helpful to you, I hope you can give me a free boost! Thank you!
License
This user content is licensed under a Standard Digital File License.
You shall not share, sub-license, sell, rent, host, transfer, or distribute in any way the digital or 3D printed versions of this object, nor any other derivative work of this object in its digital or physical format (including - but not limited to - remixes of this object, and hosting on other digital platforms). The objects may not be used without permission in any way whatsoever in which you charge money, or collect fees.
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