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Case Orange pi 4 Pro with fan
IP Report
Print Profile(1)

0.2mm layer, 2 walls, 15% infill
Designer
4.5 h
3 plates
Open in Bambu Studio
Boost
12
17
1
3
93
23
Released
Description
3D-printable case model for Orange Pi 4 Pro, designed for PETG or ABS printing. Cooling has been optimized: the design accommodates a heatsink up to 15 mm tall on both the CPU and RAM, and supports forced-air cooling with either a 30×30×10 mm or a 40×40×10 mm fan.
Additionally, the package includes mounting hardware to attach the case to the back of a monitor using VESA 100×100 or VESA 75×75 standards.
Additional materials required for assembly:
- Four self-tapping screws, 2.5–3 mm in diameter and 10–20 mm in length.
- Four self-tapping screws, 2–2.5 mm in diameter and 5–10 mm in length.
- One fan (optional choice): either 30×30×10 mm or 40×40×10 mm.
- (UPD: 01.03.2026) One fan : 50×50×10 mm.
License
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Creative Commons Attribution-Noncommercial-Share Alike









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