Phone Semiconductor Magnetic Adsorption Radiator

Smartphone Semiconductor Magnetic Cooling Device:
1. Due to FDM printing tolerances, it is recommended to scale the print by 99%-101%;
2. IPHONE MagSafe magnetic attachment kit;
3. M3 screws, 3*8 screws, 4 pieces;
4. 40*40*10mm 5V fan, 1 piece (It is recommended to purchase a hydraulic bearing 8000 RPM fan for quiet operation, high air volume and durability);
5. 40*40*11mm heatsink, 1 piece;
6. TEC1-7104 semiconductor cooling plate, 30*30*4mm, 1 piece;
7. Type-C female connector, 1 piece;

8. Nano graphene sticker, 1 piece;

9. Smartphone heat spreader/magnetic attraction sheet/magnetic attraction ring, 1 piece (IPhone does not need it, only Android phones need it, if the phone is severely hot, use a heat spreader, otherwise, a magnetic attraction sheet or ring is sufficient).

In Chongqing, with a temperature of around 40 degrees Celsius, using a 5V2A output power, the surface temperature of the cooling device can be reduced to about 4 degrees Celsius, which will not cause condensation on the phone and will effectively protect the phone's motherboard.

If you need a stronger cooling effect, you can add an inducer or use a high-power charging adapter.

PS: The cooling plate 7103 in the picture is from my first version of the cooling device, and the cooling effect is not very good. I replaced it with the current 7104 semiconductor cooling plate, but I forgot to take pictures during the process, so please ignore the cooling plate model data in the picture and purchase the TEC1-7104 semiconductor cooling plate according to the configuration list in the detailed explanation.